9.4.1 BGA Component Reballing, Fixture Method

This practice covers reballing of BGA components.
Minimum Skill Level - Advanced
suggested for technicians with soldering and component rework skills and introduction to most repair/rework procedures, but wanting extensive experience.
Conformance Level - High
This procedure most directly duplicates the physical characteristics of the unusual, and most probably complies with all the functional, environmental and serviceability factors.
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device

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